Plasma deposition of antimicrobial Cu-composite thin films

A low pressure plasma process for deposition of copper-containing hybrid organic-inorganic thin films was developed. The discharge was fed with an aerosol of an aqueous solution of a copper complex. Polymeric films, incorporating inorganic Cu compounds, were obtained.
The optimized thin coatings have potential industrial utilization as active packaging material, being very effective against pseudomonads. Viability of Pseudomonas was reduced by three orders of magnitude in the presence of developed films, thus suggesting further investigation of the technique under food packaging conditions. An article about this research was published in Innovative Food Science & Emerging Technologies.
Click here for an abstract of the article.

This news item is also included in our monthly overview, the NVC Members-only Update. If you have any questions, please contact us: info@nvc.nl, +31-(0)182-512411.