3D-printed ‘smart cap’ uses electronics to detect spoiled food

UC Berkeley engineers are expanding the portfolio of 3D printing technology to include electrical components. They have put the new technology to the test by printing a wireless “smart cap” for a milk carton that detected signs of spoilage using embedded sensors.
Polymers are poor conductors of electricity, and thus bad candidates for electronic devices. To get around this, the researchers started off by building a system using polymers and wax. They would then remove the wax, leaving hollow tubes into which liquid metal – they used silver – was injected and then cured. An article about the research is published in Microsystems & Nanoengineering (News Item UC Berkeley, 20 July 2015).
Click here for the news item.
Click here for the published article.
Click here for information about the Caps and Closures Conference 2015 (Nice, 4-5 November). NVC members receive a 15% discount.

If you have any questions about this subject, please contact us: info@nvc.nl, +31-(0)182-512411. This item is also included in our monthly overview, the NVC Members-only Update.