NVC present at Packaging Design & Innovation Summit (Amsterdam)

          

On 10-11 March the 11^th edition of the Packaging Design & Innovation Summit will take place in Amsterdam, the Netherlands. This two-day conference is supported by NVC as it brings together the brands, the packagers and the designers and covers the key elements of creating packages that add value to brand and product. Professionals from SAB MILLER, SAMSUNG, UNILEVER, NESTLÉ and  PROCTER & GAMBLE will offer you inspiring sessions. Click here for more information.

Because of the cooperation between NVC and The European Networking Group, NVC members are entitled to a 15% discount (25% discount for 3 or more registrations from the same company received on the same day). Please send an email to Charissa Koolen to receive the discount code.
For more information or to register please contact Joanna Serweta at jserweta@engspain.com or +34 91 535 7087.